Cornell NanoScale Science & Technology Facility (CNF)

• 显微与成像

  Bruker Dimension Icon atomic force microscope

• 微纳加工

  JEOL JBX-6300FS electron-beam lithography system

• 微纳加工

  JEOL JBX-9500FS electron-beam lithography system

• 实验室设备

  Malvern NS300 NanoSight

• 实验室设备

  Malvern Nano ZS Zetasizer

• 实验室设备

  Nanonex NX-2500 nanoimprint system

• 实验室设备

  Oxford FlexAL ALD system

• 显微与成像

  Zeiss Gemini SEM

• 显微与成像

  Zeiss Supra 55VP field-emission SEM

• 显微与成像

  Zeiss Ultra 55 field-emission SEM

• 微纳加工

  Cee Apogee resist spinners handle pieces through 200 mm wafers at more than 6000 rpm and up to 30000 rpm/s acceleration.

• 微纳加工

  Disco DA810 grinder processes silicon, glass, sapphire, SiC and III-V workpieces to 8 inches; Disco dicing saw supports multiple substrate classes.

• 实验室设备

  Finetech Fineplacer pico ma die bonder aligns chips to 20 x 20 mm over substrates to 100 x 100 mm with 5 micrometre placement accuracy and force to 20 N.

• 微纳加工

  JEOL JBX-6300FS supports direct-write EBL on wafers to 150 mm with sub-10-nm capability.

• 微纳加工

  JEOL JBX-9500FS EBL operates at 100 kV with 100 MHz clock and 1 x 1 mm write field, handling 10 mm pieces through 300 mm wafers and sub-10-nm features.

• 微纳加工

  Oxford PlasmaPro 100 Cobra 300 ICP-RIE accepts 100, 150 and 200 mm wafers and provides 3 kW ICP source plus optical endpoint detection.

• 微纳加工

  SUSS Gamma robotic coat/develop cluster handles wafer cassettes to 200 mm and includes AltaSpray for non-planar substrates.

登记范围证据

• ◇Access: Open user facility serving academic and company projects.
• ◇Commercial terms: Usage charged per hour by tool; industrial users pay market-equivalent rates.
• ◇Remote access: Some simple projects may be executed remotely by staff or independent contractors.
• ◇Official-source, facility-specific instrument evidence is available. Current configuration, availability, price, and project fit require confirmation.

本条目依据的证据