Electron Microscopy Center (EMC)

• 显微与成像

  Olympus DSX 1000 light microscope

• 表面分析

  Thermo Scientific K-Alpha XPS

• X 射线与中子

  X-ray diffraction instrumentation

• 显微与成像

  dual-beam FIB/SEM

• 实验室设备

  micro-CT system

• 显微与成像

  scanning electron microscopes

• X 射线与中子

  small-angle X-ray scattering system

• 显微与成像

  transmission electron microscope

• 显微与成像

  FEI Helios NanoLab 660 dual-beam FIB/SEM provides sub-nanometre SEM imaging from 500 V to 30 kV, gallium FIB milling and automated slice-and-view 3D reconstruction.

• 显微与成像

  FEI Talos F200X TEM operates at 80/100/120/200 kV, has 0.16 nm resolution, 16 MP Ceta camera, Super-X EDS and ultrafast Dual EELS.

• 分析仪器

  Helios 660 includes Oxford EDX and EBSD for elemental/crystal-orientation mapping, including 3D EDX/EBSD.

• 实验室设备

  Thermo HeliScan Mk2 microCT uses a 20-160 kV source, 3072 x 3072 16-bit detector, 800 nm spatial resolution and samples to 240 mm/15 kg.

• 表面分析

  Thermo K-Alpha XPS uses monochromated Al K-alpha, microfocused imaging, neutralization and ion depth profiling for the top approximately 10 nm.

• 实验室设备

  Xenocs Xeuss 2.0 SAXS/WAXS uses a Cu source and PILATUS3 detector with powder/gel, capillary, grazing-incidence, flow-cell and heating stages.

登记范围证据

• ◇Access: Serves university users and industries locally and nationwide.
• ◇External mode: External users may engage as customers or train for repeated instrument use.
• ◇Official-source, facility-specific instrument evidence is available. Current configuration, availability, price, and project fit require confirmation.

本条目依据的证据