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有公开服务证据

Stanford Nanofabrication Facility

Stanford Nanofabrication Facility at Stanford University provides shared-facility access for nanofabrication and microfabrication, and surface and thin-film characterization. Registration, training, project review, fees, and current instrument availability may apply.

公开提供对外服务

2 项服务能力 10 条设备记录 核查于 2026年8月29日

公开描述的能力

Fabrication

Nanofabrication and microfabrication

Advanced characterization

Surface and thin-film characterization

技术清单

技术与设备

3 类设备
  • 微纳加工

    cleanroom process equipment

  • 微纳加工

    electron-beam lithography system

  • 微纳加工

    photolithography system

  • 实验室设备

    semiconductor process equipment

  • 微纳加工

    thin-film deposition system

  • 实验室设备

    Aixtron Black Magic graphene CVD, Aixtron III-N/III-V MOCVD and AMAT Centurion epitaxy systems support graphene, compound-semiconductor and silicon-compatible growth workflows.

  • 微纳加工

    Current inventory lists ASML PAS 5500/60 i-line stepper, Heidelberg MLA150 direct-write systems and Karl Suss MA-6 contact aligners for lithography.

  • 微纳加工

    Fiji 1/2/3 ALD and MVD systems provide plasma-enhanced and thermal atomic-layer deposition with tool-specific material/cleanliness restrictions.

  • 微纳加工

    KLA Rapier deep-reactive-ion etcher, Lam TCP 9400 poly etcher, MRC RIE and Plasma-Therm Versaline etch/CVD systems support silicon, dielectric and metal processing.

  • 显微与成像

    Nanoscribe Photonics GT supports two-photon 3D patterning; Asylum/NanoCue AFM, Keyence VHX-6000, profilometers and electrical test stations provide metrology.

登记范围证据

  • ◇External access: nano@stanford provides a dedicated external-user pathway for academic, government, nonprofit and industry users..
  • ◇Capabilities: SNF supports deposition, patterning and etching of thin-film metals, dielectrics and semiconductors..
  • ◇Address: Official visit page gives the Allen Building delivery address and room..
  • ◇Official-source, facility-specific instrument evidence is available. Current configuration, availability, price, and project fit require confirmation.

本条目依据的证据

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