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Public service evidence

Cornell NanoScale Science & Technology Facility (CNF)

Cornell NanoScale Science & Technology Facility (CNF) at Cornell University provides shared-facility access for nanofabrication and microfabrication, surface and thin-film characterization, and optical microscopy and spectroscopy. Registration, training, project review, fees, and current instrument availability may apply.

External services publicly offered

3 capabilities 17 equipment records Reviewed 2026-08-29

Publicly described capabilities

Fabrication

Nanofabrication and microfabrication

Advanced characterization

Surface and thin-film characterization

Advanced characterization

Optical microscopy and spectroscopy

Technical inventory

Techniques and equipment

3 equipment types
  • Microscopy & imaging

    Bruker Dimension Icon atomic force microscope

  • Micro/nanofabrication

    JEOL JBX-6300FS electron-beam lithography system

  • Micro/nanofabrication

    JEOL JBX-9500FS electron-beam lithography system

  • Laboratory equipment

    Malvern NS300 NanoSight

  • Laboratory equipment

    Malvern Nano ZS Zetasizer

  • Laboratory equipment

    Nanonex NX-2500 nanoimprint system

  • Laboratory equipment

    Oxford FlexAL ALD system

  • Microscopy & imaging

    Zeiss Gemini SEM

  • Microscopy & imaging

    Zeiss Supra 55VP field-emission SEM

  • Microscopy & imaging

    Zeiss Ultra 55 field-emission SEM

  • Micro/nanofabrication

    Cee Apogee resist spinners handle pieces through 200 mm wafers at more than 6000 rpm and up to 30000 rpm/s acceleration.

  • Micro/nanofabrication

    Disco DA810 grinder processes silicon, glass, sapphire, SiC and III-V workpieces to 8 inches; Disco dicing saw supports multiple substrate classes.

  • Laboratory equipment

    Finetech Fineplacer pico ma die bonder aligns chips to 20 x 20 mm over substrates to 100 x 100 mm with 5 micrometre placement accuracy and force to 20 N.

  • Micro/nanofabrication

    JEOL JBX-6300FS supports direct-write EBL on wafers to 150 mm with sub-10-nm capability.

  • Micro/nanofabrication

    JEOL JBX-9500FS EBL operates at 100 kV with 100 MHz clock and 1 x 1 mm write field, handling 10 mm pieces through 300 mm wafers and sub-10-nm features.

  • Micro/nanofabrication

    Oxford PlasmaPro 100 Cobra 300 ICP-RIE accepts 100, 150 and 200 mm wafers and provides 3 kW ICP source plus optical endpoint detection.

  • Micro/nanofabrication

    SUSS Gamma robotic coat/develop cluster handles wafer cassettes to 200 mm and includes AltaSpray for non-planar substrates.

Registry scope evidence

  • Access: Open user facility serving academic and company projects.
  • Commercial terms: Usage charged per hour by tool; industrial users pay market-equivalent rates.
  • Remote access: Some simple projects may be executed remotely by staff or independent contractors.
  • Official-source, facility-specific instrument evidence is available. Current configuration, availability, price, and project fit require confirmation.

Evidence used for this listing

Vicena compiles these public listings from cited laboratory sources. A listing does not imply a partnership, current availability, pricing, or acceptance of a project. This profile is not an endorsement, availability check, quote, or representation of a commercial relationship.