Pritzker Nanofabrication Facility (PNF)

• Microscopy & imaging

  SEM/AFM metrology equipment

• Micro/nanofabrication

  cleanroom process equipment

• Micro/nanofabrication

  electron-beam lithography system

• Micro/nanofabrication

  photolithography system

• Micro/nanofabrication

  plasma etching system

• Micro/nanofabrication

  thin-film deposition system

• Micro/nanofabrication

  AJA Orion sputtering, Angstrom EvoVac/Nexdep and Plassys MEB550S support sputter, e-beam, thermal and ion-assisted deposition.

• Microscopy & imaging

  Bruker Dimension Icon AFM supports topography plus nanomechanical, nanoelectrical and nanoscale chemical mapping.

• Laboratory equipment

  Cambridge Fiji G2 plasma ALD and Savannah ALD support thermal/plasma films and conformal coating of ultra-high-aspect-ratio substrates.

• Microscopy & imaging

  FEI Quanta 650 FEG SEM has eight detectors, sub-5-nm imaging and Nabity NPGS electron-beam patterning.

• Micro/nanofabrication

  Heidelberg MLA150 direct-write lithography provides maskless exposure, backside alignment and a 150 x 150 mm exposure area.

• Micro/nanofabrication

  Plasma-Therm ICP chlorine/fluorine systems, Versaline deep-silicon RIE and Vision 310 PECVD support plasma processing.

• Laboratory equipment

  Raith EBPG5200 electron-beam writer handles substrates and masks to 155 mm/6 inches, operates at 20, 50 or 100 kV and supports features below 8 nm.

Registry scope evidence

• ◇External access: Open to all properly trained users through a fee-for-use structure..
• ◇Facility: 10,000-square-foot ISO class 5 cleanroom supporting R&D and prototype production..
• ◇Capabilities: Lithography, deposition, plasma etching, microscopy and thin-film metrology are listed..
• ◇Address: Facility is in Eckhardt Research Center lower level 1..
• ◇Official-source, facility-specific instrument evidence is available. Current configuration, availability, price, and project fit require confirmation.

Evidence used for this listing